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1. 32x 200G QSFP56 ports 2. 2 hot-swap AC power supplies (1+1 redundancy), 6 hot-swap fans 3. Support Supports PFC/ECN/RoCEv2 to build intelligent, lossless data center networks. 4. Equipped with MLAG/VXLAN/GENEVE, it boasts strong virtualization and horizontal scaling capabilities. 5. Adaptable to scenarios such as data center Spine/Leaf, AI clusters, and core aggregation. 6. Improved OAM/Y.1731/sFlow for visualized operation and maintenance and rapid fault location. 7. Supports hardware ACL, ARP & CPU protection, and 802.1X for comprehensive security.See more
QSFPTEK S8700-32CD L3+ data center switch is designed with 32×200G QSFP56 ports. It is equipped with 2 hot-swap AC power supplies (1+1 redundancy, DC optional) and 3 built-in smart fans to ensure outstanding redundancy and efficient heat dissipation with front-to-back airflow. The S8700-32CD intelligent managed switch supports flexible management including SNMP v1/v2/v3, WEB, and CLI for easy operation and maintenance. As a high-performance Layer 3 switch, it supports advanced features including MLAG, VXLAN, PFC, ECN, and RoCEv2, making it an ideal solution for AI clusters, cloud data centers, high-speed core networks, and large-scale enterprise interconnection for efficient and lossless network deployment.
Scenario 1:

32×200G QSFP56 Ports for High-Density Deployment
200G high-speed interfaces for server access and spine-leaf interconnection. 32 ports perfectly meet high-bandwidth core and aggregation network requirements.

RDMA(Remote Direct Memory Access) provides high throughput and ultra-low latency with low CPU overhead. Once end-to-end network connectivity is established, PFC(Priority Flow Control) and ECN (Explicit Congestion Notification) can be enabled to ensure lossless transport for RoCE traffic.

Dual power supplies allow for on-the-fly replacements, the chassis features front-to-back airflow, and hot-swappable fans enable instant replacement of faulty fans at any time.


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Series 200G/400G Switches
Models S8700-32CD | 32x 200G QSFP56 | L3+