High-density and High-reliability Solutions Designed for Crytek

Customer Name: Crytek

Industry: Game Developers

Country: Germany

Company Size: 500 to 1,000 employees

Customer Voice:

We are a game developer and we developed our game engine. As our business grows, we have introduced many devices to expand the network to meet the growing bandwidth demand, but problems have also begun to arise. Due to the large number of devices, wiring has become a problem. Limited space and a large number of devices have made us urgently seek high-density connection solutions. Frequent plugging and unplugging of devices and the demand for network redundancy and reliability are also increasing, so we urgently need a solution.

Challenges

1. The large number of devices leads to a complex wiring structure, which needs to be optimized to simplify the wiring and facilitate maintenance.

2. Due to limited space, continue with high-density solutions.

3. The network redundancy and reliability requirements are high, and the solution needs to support strong redundancy and reliability.

Solutions

Due to several customer requirements, we decided to deploy a leaf-spine architecture for the customer after restoring the customer's network environment. This architecture can simplify the overall wiring structure, forming a consistent and symmetrical topology, making wiring easier and eliminating the need for complex hierarchical wiring structures. Each leaf switch only needs to connect to a fixed number of spine switches, reducing unnecessary cross-layer or unlimited crossover.

The Leaf-spine architecture is also very suitable for high-density environments. It reduces the demand for cables and wiring congestion by simplifying the communication path to two hops, freeing up space in the middle of the data and making wiring more efficient and neat.

Finally, the Leaf-Spine architecture also has strong redundancy and reliability. It supports the use of Equal-Cost Multi-Path Routing, allowing data to be sent simultaneously on different links to fully utilize all available bandwidth. When a link fails, ECMP can quickly switch to other paths to ensure that network traffic transmission is not interrupted.

What Do We Offer

Brand switch compatibility test: QSFPTEK provides a complete range of brand switches and can conduct compatibility testing on your equipment to ensure availability.

Bulk purchase discounts: Order in bulk to enjoy competitive pricing and improve capital utilization.

Test report provided: QSFPTEK can provide product test reports to evaluate the product before purchasing.

Comprehensive quality certification: QSFPTEK's modules comply with industry standards such as CE, FCC, ROSH, ISO9001, REACH, UL, and TÜV.

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Customer Benefits

After deploying the Leaf-Spine architecture, the network layers can be reduced and high-bandwidth and low-latency connections can be provided for the network. Leaf-Spine is highly scalable. In subsequent upgrades, more devices can be added directly without changing the existing devices in the architecture, and the upgrade can be completed without interrupting network services. In subsequent operation and maintenance, due to the simple wiring structure, faults can be discovered and resolved more quickly. The equipment provided by QSFPTEK is cost-effective and low power, which can effectively reduce the overall power consumption of the network and reduce operating costs.